Micro Powder Injection Moulding Of Metals And Ceramics

Powder injection molding of metal and ceramic parts 67 the starting material for pim usually termed feedstock is a homogeneous pelletized mixture of metal or ceramic powder and an organic multi component binder.

Micro powder injection moulding of metals and ceramics. This chapter discusses the state of research and development of microcomponent powder injection molding micropim of metals and to a lesser degree ceramics. To overcome the lack of micro manufacturing processes suitable for medium and large scale production as well as to process high resistive materials a special variant of micro injection molding is currently under development. Powder injection molding pim has emerged as a viable method for producing complex shaped parts at a competitive cost. This method is well established in replication by injection molding and metal injection molding mim or ceramic injection molding cim.

While micro injection moulding of plastic is common practice metal and ceramic powder. Industrial use of micro components is determined by the availability of efficient manufacturing techniques. Ceramics are referred to where innovative developments have taken place which have not yet been tried with metal materials but will most probably be attempted in the near future. Micro powder injection molding pim of metals or ceramics is an alternative to fabricate structures of these materials in large series especially in the micron range.

The metal powders used in filaments for fff are in principle the same ones as used in metal injection moulding mim 19. Using enhanced machine technology and special tempering procedures this process enables the manufacturing of metal and ceramic devices with smallest wall thicknesses of 50. Micro powder injection moulding of metals and ceramics 301 certain cases yttrium oxide stabilized zirconium oxide with a mean particle size of 0 3 0 4 m was used ruprecht piotter 1999. 3 1 2 2 micro powder molding.

Micro powder injection molding micropim which already enables the manufacturing of finest detailed components with structure sizes down to a few ten micrometer. The binder and the powder are combined in a variety of compounding equipment such as extruders and mixers. This is an advantage compared to powder bed am techniques which require.