Metal Ceramic Packages

Chip carrier packages may be made of ceramic or plastic and are usually secured to a printed circuit board by soldering though sockets can be used for testing.

Metal ceramic packages. Ceramic flat package surface flat package fcp quad flat package qfp ceramic flat package suitable for surface fix small volume light weight high package density. Our technical know how and design capabilities encompass glass to metal ceramic to metal certms and multilayer high temperature co fired ceramic htcc technologies. Hermetic packages come in a variety of designs to meet demanding electrical and thermal requirements in numerous applications such as down hole drilling space and medical. Utilizing decades of.

Ametek offers both glass to metal seal and ceramic to metal seal technology to its customers. Kyocera offers a wide variety of standard ceramic packages including ceramic dual inline packages c dip ceramic small outline packages c sop ceramic pin grid array packages c pga ceramic quad flat packages c qfp ceramic quad flat j leaded packages c qfj and ceramic quad flat non leaded packages c qfn. When working with customers schott s experts draw on more than 75 years of experience in developing and manufacturing hermetically sealed packages. Ceramic substrates for probe cards.

Epi provides ceramic tape systems ceramic substrates multilayer ceramic substrates metallization services metal to ceramic assemblies and microelectronic ceramic packaging. Kyocera will present its ceramic packages at cioe 2018 china s most popular optoelectronics exhibition. Depending on the application weight thermal solution and material requirements ametek can help you design a package using one of these technologies to best meet your requirements. Epi is a powder to package fully integrated htcc precision ceramics manufacturer located in newburyport massachusetts.

We specialize in variety of aluminas zta and aln. All packages are plated with electrolytic nickel and gold to meet the exacting standards of the microelectronics packaging industry. Standard packages and lids for device evaluation. Lead pitch for cfp cqfp lead wires is 1 27 mm and 1 27 1 00 0 63 mm respectively.

Ceramic packages for large scale integration lsi devices. The main feature of hermetic packages is a seal ring or other metallized component that allows the attachment of a ceramic or metal lid. Our high quality ceramic packages support a wide variety of rf power transistors and mmics including transistors fabricated in si gaas and gan. Material properties process flow.